Hermetic Packaging Engineer
Paradromics, Inc. is looking for a Hermetic Packaging Engineer to contribute to the hardware development of key components of our neural implant system. This includes the design and manufacturing of hermetic packages for long term neural implantation. Experience with development and characterization of hermetic, microelectronics packages is required. Close coordination with other engineers in the team will be essential, therefore excellent communication and interpersonal skills are crucial in excelling at this role. If you like big challenges, working at the frontier of human technology, and have worked on and shipped high-performance hardware in the past, we would like to hear from you.
Required Skills & Experience
● In-depth understanding of brazing, especially with regard to forming hermetic seals
● In-depth understanding of sintering in both ceramic and metal systems
● Experience with mechanical and materials design to mitigate effects of thermal expansion
● Experience with materials characterization techniques such as SEM, EDS, mechanical cross-sectioning, FIB, etc
● Experience with functional characterization of hermetic packages including helium leak testing, strength testing, thermal shock testing, etc
● Experience with medical device or highly regulated environments
● Excellent verbal and oral communication skills
● Very strong analytical and debugging skills
● Ability to produce well-written technical reports and documentation
● Minimum of Masters degree in Materials science, physics or a closely related discipline
● Minimum 4 years related work experience
Preferred Skills & Experience
● Experience with manufacture of hermetic feedthroughs
● Experience in welding techniques including laser welding
● Experience in electronics assembly technologies such as soldering, wirebonding, flip chip bonding, etc.
● Experience in microelectronics packaging technologies and testing such as underfill encapsulation, burn-in testing, accelerated aging, etc.
Paradromics is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, or national origin.
Paradromics, Inc. is looking for a Hermetic Packaging Engineer to contribute to the hardware development of key components of our neural implant system. This includes the design and manufacturing of hermetic packages for long term neural implantation. Experience with development and characterization of hermetic, microelectronics packages is required. Close coordination with other engineers in the team will be essential, therefore excellent communication and interpersonal skills are crucial in excelling at this role. If you like big challenges, working at the frontier of human technology, and have worked on and shipped high-performance hardware in the past, we would like to hear from you.
Required Skills & Experience
● In-depth understanding of brazing, especially with regard to forming hermetic seals
● In-depth understanding of sintering in both ceramic and metal systems
● Experience with mechanical and materials design to mitigate effects of thermal expansion
● Experience with materials characterization techniques such as SEM, EDS, mechanical cross-sectioning, FIB, etc
● Experience with functional characterization of hermetic packages including helium leak testing, strength testing, thermal shock testing, etc
● Experience with medical device or highly regulated environments
● Excellent verbal and oral communication skills
● Very strong analytical and debugging skills
● Ability to produce well-written technical reports and documentation
● Minimum of Masters degree in Materials science, physics or a closely related discipline
● Minimum 4 years related work experience
Preferred Skills & Experience
● Experience with manufacture of hermetic feedthroughs
● Experience in welding techniques including laser welding
● Experience in electronics assembly technologies such as soldering, wirebonding, flip chip bonding, etc.
● Experience in microelectronics packaging technologies and testing such as underfill encapsulation, burn-in testing, accelerated aging, etc.
Paradromics is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, or national origin.